The most common FPC base materials are PI (Polyimide) and PET (Polyester):

PI: Offers excellent heat resistance and chemical stability, capable of withstanding reflow soldering temperatures. It is the preferred choice for industrial, automotive, and consumer electronics applications.
PET: Lower cost but limited heat resistance, mainly used in low-temperature environments or simple flex connections that do not require soldering.

Surface finishing is critical to prevent copper oxidation and ensure good solderability:

ENIG (Electroless Nickel Immersion Gold): Provides a flat surface, ideal for fine-pitch components, and is the most widely used option.
Electroplated Gold: High hardness and excellent wear resistance, suitable for gold fingers and applications requiring frequent insertion and removal.
OSP (Organic Solderability Preservative): The lowest-cost option, but sensitive to storage conditions and not suitable for multiple reflow cycles.

These connection methods are mainly used for signal transmission:

Connector Insertion: FPC gold fingers are directly inserted into connectors, making maintenance and replacement easier.
ACF / ACP (Anisotropic Conductive Film/Paste): Uses anisotropic conductive materials, commonly applied in displays, touch panels, and fine-pitch thermo-compression bonding.

FFC consists of flat copper conductors laminated between two insulating films, making it suitable for simple signal transmission and straight-line connections. FPC, on the other hand, is a true printed circuit with patterned traces, capable of supporting complex designs and component mounting. For point-to-point connections such as between a display and a mainboard, FFC is often the most cost-effective choice.

The main advantages of precision etching are stress-free processing and burr-free edges. Unlike stamping, chemical etching removes material without altering its physical properties, preventing deformation. It also eliminates the need for expensive tooling, significantly reducing initial development costs and making it ideal for high-precision and small-batch production.

Stainless Steel (SUS304 / 316 / 430): Commonly used for EMI shields and precision filters.
Copper Alloys (Brass, Phosphor Bronze, Beryllium Copper): Excellent electrical conductivity, widely used for lead frames, springs, and contacts.
Special Alloys: Such as nickel alloys for high-temperature or high-hardness applications, where etching effectively meets demanding processing requirements.

Bend Line Design: Pre half-etching at bending areas improves accuracy and consistency during forming.
Identification: Logos and serial numbers etched on metal surfaces provide permanent and aesthetic marking.
Packaging Structures: Creating cavities for chips or conductive adhesives is a key process in semiconductor and MEMS applications.

Stamping can cause stress-induced deformation, while laser processing introduces heat-affected zones around holes. Precision etching allows simultaneous processing of numerous micro-holes with smooth, uniform walls, free from thermal or mechanical stress. This makes it ideal for coffee filters, smartphone speaker meshes, precision chemical filters, and fuel cell bipolar plates.

A one-stop supplier provides complete services from design support and prototyping to mass production, including SMT assembly and backend testing. This avoids responsibility gaps between multiple vendors. Full-process control improves yield, shortens development cycles, and significantly reduces overall supply chain management costs.

We offer a fast response mechanism. When issues arise at the customer’s production or assembly site, an initial assessment is typically provided within 24 hours. For specification or quality-related concerns, we actively participate in root cause analysis and corrective actions, acting as a long-term technical partner rather than just a manufacturer.

Environmental compliance is a fundamental commitment. All materials used in our FPC, FFC, and etching processes can be supported by SGS-issued RoHS / REACH reports or hazardous substance declarations, ensuring compliance with the latest regulations and smooth market access in Europe, North America, and other regions.