LONGSHENG TECHNOLOGY
DEDICATED TO THE CORE, BUILT FOR TRUST.
Application
APPLICATION
ABOUT US
As a professional manufacturer of flexible printed circuit boards (FPCs) in the upstream of the information industry, Longshen Technology Co., Ltd. has been expanding its market with advanced technology and products, building its reputation with high-quality services, and always paying attention to customer needs. We continuously develop new products and provide the strongest support for our customers, which has earned us widespread praise.
Establishment time
0
Company History
0+
Printing process
Demand for various types of inks, including conductive adhesives, silver paste, solder resist, and text inks.
Molding process
Automated lamination effectively combines dry film with the copper surface.
DES process
The etching process is used to remove the areas to be etched, leaving the desired pattern and conductors.
Copper plating process
Copper plating lines specifically designed for flexible printed circuit boards, used for via and surface copper plating operations.
Drilling process
Through-hole machining according to specified layers
Electrical testing
O/S electrical testing, including 2-wire and 4-wire flying probe testing.
Lamination process
The covering film and related reinforcing materials are subjected to rapid high-temperature pressing.
Surface treatment process
Remove surface impurities and roughen the copper surface of the substrate.
Punch drilling
Fully automated CCD positioning punching improves the accuracy of subsequent punching processes.
Exposed process
Working indoors, the graphic and circuit images are transferred onto the copper surface.
Printing process
Demand for various types of inks, including conductive adhesives, silver paste, solder resist, and text inks.
Molding process
Automated lamination effectively combines dry film with the copper surface.
DES process
The etching process is used to remove the areas to be etched, leaving the desired pattern and conductors.
Copper plating process
Copper plating lines specifically designed for flexible printed circuit boards, used for via and surface copper plating operations.
Drilling process
Through-hole machining according to specified layers
Electrical testing
O/S electrical testing, including 2-wire and 4-wire flying probe testing.
Lamination process
The covering film and related reinforcing materials are subjected to rapid high-temperature pressing.
Surface treatment process
Remove surface impurities and roughen the copper surface of the substrate.
Punch drilling
Fully automated CCD positioning punching improves the accuracy of subsequent punching processes.
Exposed process
Working indoors, the graphic and circuit images are transferred onto the copper surface.
NEWS
NEWS
Environmental protection
ECO-
FRIENDLY
Longshen Technology is committed to environmental protection.
Together with Longshen, we are committed to protecting the Earth and upholding the philosophy of sustainable operation. We solemnly promise to refuse to use raw materials from conflict-affected mining areas, adhere to international conventions and domestic environmental regulations, and fully comply with international safety and hygiene standards. Through continuous innovation and process optimization, we are dedicated to reducing our environmental impact, fulfilling our long-term commitment to social and environmental responsibility, and integrating sustainable development into every aspect of our business operations.