Practical Column

Practical Column

FPC Coverlay Lamination

FPC Manufacturing Process in Full Analysis - Cover Film and Lamination: Precise Control of "Overflow" - A Double-Edged Sword
Giving Circuits a Protective Cover: Analyzing the Key Impact of Excess Adhesive on Post-SMT Processing

In the FPC manufacturing process, if etching is for defining the circuit, then coverlay lamination is for putting a protective layer on the circuit. However, the success of this protective layer depends not on the PI film itself, but often on controlling the "glue overflow" beneath the PI. ... (Continue reading)

FPC無膠基材

FPC Material Selection Analysis - Adhesive-Free Substrate: Value Analysis in Ultra-Thin and Lightweight Designs
Key technologies for achieving ultra-thin and lightweight design

In the process of FPC moving towards 5G, wearable devices, and foldable screens, "space" has become the most expensive resource. Previously, the mainstream adhesive-coated substrate involved sandwiching a layer of epoxy resin or acrylic adhesive between a PI film and copper foil. Adhesive-coated copper is limited by the adhesive's high coefficient of thermal expansion (CTE) and high dielectric loss, leading to signal distortion at high frequencies; in contrast, adhesive-free copper... (Continue reading)

FPC 選材與製程優化

FPC Material Selection Full Analysis - Substrate Selection: Why is PI the preferred answer for mainstream processes?？
Investigating the impact of irreversible heat shrinkage of PET on surface metallization (SMT)

In the world of flexible printed circuit boards (FPCs), material selection and structural configuration are not only cost issues, but also fundamental to product lifespan. From a process perspective, many projects seem to go smoothly in the prototyping (EVT) stage, only to fail during the surface mount technology (SMT) high-temperature reflow soldering process... (Continue reading)

FPC 結構組成與設計

FPC Material Selection: A Comprehensive Analysis - Copper Foil Selection: The Microstructure that Determines FPC Bending Life
As the artery of signal transmission, the microstructure of copper foil directly determines the reliability of products in dynamic environments.

Why do some flexible circuit boards break after only 500 bends, while others can bend 10,000 times, even with copper foil of the same thickness?" This question requires an understanding of the molecular crystal structure of copper foil. Incorrect copper foil selection is a major cause of high return rates in consumer electronics... (Continue reading)

 

 
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